Horizontally oriented and vertically stacked memory cells
AssigneeMicron Technology, Inc.
InventorsTimothy A. Quick, Eugene P. Marsh
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsTimothy A. Quick, Eugene P. Marsh
Estimating the term…
Horizontally oriented and vertically stacked memory cells are described herein. One or more method embodiments include forming a vertical stack having a first insulator material, a first memory cell material on the first insulator material, a second insulator material on the first memory cell material, a second memory cell material on the second insulator material, and a third insulator material on the second memory cell material, forming an electrode adjacent a first side of the first memory cell material and a first side of the second memory cell material, and forming an electrode adjacent a second side of the first memory cell material and a second side of the second memory cell material.
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
Dependencies are inferred from the claim text.