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US 2013/0153820 A1Published application
Method and Composition for Chemical Mechanical Planarization of a Metal-Containing Substrate
AssigneeAir Products and Chemicals, Inc.
InventorXiaobo Shi
Life of this patent
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Abstract
A composition and associated method for chemical mechanical planarization of a metal-containing substrate afford low dishing levels in the polished substrate while simultaneously affording high metal removal rates. Suitable metal-containing substrates include tungsten- and copper-containing substrates. Components in the composition include a silatrane compound, an abrasive, and, optionally, a strong oxidizing agent, such as a per-compound.
Claims8
1-9. (canceled)
A polishing composition comprising:
- a) an abrasive;
- b) a silatrane compound comprising a polycyclic compound and having at least one silicon atom present in a first bridgehead position and having at least one nitrogen atom present in a second bridgehead position;
- and
- c) an oxidizing agent.
1 more element
Dependencies are inferred from the claim text.