Wafer-level intrapixel getter reflector whole die encapsulation device and method
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorRichard J. Blackwell, JR.
Life of this patent
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Abstract
An apparatus and method for a wafer level vacuum package uncooled microbolometer focal plane array (FPA) on a wafer level substrate with a thin film getter-reflector (G-R). The G-R removes gas from the vacuum package and is reflective in the frequency band of the FPA. Sensor pixels are supported about a quarter-wavelength above the G-R which is within the perimeter of the imaging array. The package is evacuated through a single aperture, and vacuum is maintained for the lifetime of the FPA. Imaging sensor size is reduced while maintaining resolution by reducing non-imaging area.
Claims20
A wafer level vacuum package uncooled microbolometer focal plane array (FPA) device comprising:
- a wafer level substrate;
- a getter-reflector (G-R) on said substrate, wherein said G-R comprises a material that removes gas from said vacuum package and said G-R material is reflective in frequency band of said FPA;
- a plurality of sensor pixels supported above said G-R by a plurality of pixel supports;
- a lid encapsulating said FPA;
- wherein said G-R is within perimeter of imaging array of said plurality of sensor pixels;
- and package vacuum is maintained for lifetime of said FPA;
- and
- whereby imaging sensor size is reduced while maintaining resolution by reducing non-imaging area.
A method of forming a wafer level vacuum package uncooled microbolometer focal plane array (FPA) device comprising the steps of:
- providing a wafer level substrate;
- forming a getter-reflector (G-R) on said substrate, wherein said G-R comprises a material that removes gas from said vacuum package and said G-R material is reflective in frequency band of said FPA;
- forming a plurality of sensor pixels on a sacrificial layer;
- removing said sacrificial layer, said plurality of sensor pixels supported above said G-R by a plurality of pixel supports;
- forming a package lid over said FPA;
- evacuating FPA package formed by said lid over said FPA;
- wherein said G-R is within perimeter of imaging array of said plurality of sensor pixels;
- and package vacuum is maintained for lifetime of said FPA;
- and
- whereby imaging sensor size is reduced while maintaining resolution by reducing non-imaging area.
A wafer level vacuum package uncooled microbolometer focal plane array (FPA) device comprising:
- a wafer level substrate;
- a thin film getter-reflector (G-R) on said substrate, wherein said G-R comprises a material that removes gas from said vacuum package;
- a plurality of sensor pixels supported about a quarter-wavelength in said frequency band of said FPA above said G-R by a plurality of pixel supports;
- wherein said G-R is within perimeter of imaging array of said plurality of sensor pixels;
- said device package is evacuated through a single aperture;
- package vacuum is maintained for lifetime of said FPA;
- and
- whereby imaging sensor size is reduced while maintaining resolution by reducing non-imaging area.
Dependencies are inferred from the claim text.