Imaging apparatus
AssigneeNikon Corporation
InventorTadao Isogai
Life of this patent
Estimating the term…
Abstract
An imaging apparatus includes a sensor chip which has pad electrodes, to which electrical signals to be supplied to a pixel array are input, a glass substrate on which first wiring patterns connected to signal lines, to which signals of the pixel array are output, and second wiring patterns connected to pad electrodes are formed, an upper signal processing chip and a lower signal processing chip which have pad electrodes to which signals processed by signal processing circuits are output, and flexible printed boards which have FPC wiring electrically connected to the pad electrodes and FPC wiring electrically connected to the second wiring patterns formed on the glass substrate.
Claims19
An imaging apparatus comprising:
- a sensor chip having a pixel array in which a plurality of pixels are arranged to output signals according to incident light to signal lines, and input terminals to which electrical signals to be supplied to the pixel array are input;
- a substrate which is disposed on the light-receiving surface side of the sensor chip, and on which first wiring patterns electrically connected to the signal lines and second wiring patterns electrically connected to the input terminals are fanned;
- signal processing chips which have signal processing circuits which process the signals input through the first wiring patterns, and output terminals to which the signals processed by the signal processing circuits are output;
- and
- connection boards which have first wiring electrically connected to the output terminals of the signal processing chips and second wiring electrically connected to the second wiring patterns formed on the substrate.
An imaging apparatus comprising:
- a sensor chip having a pixel array in which a plurality of pixels are arranged to output signals according to incident light to signal lines, and input terminals to which electrical signals to be supplied to the pixel array are input;
- a substrate which is disposed on the light-receiving surface side of the sensor chip, and on which first wiring patterns electrically connected to the signal lines and second wiring patterns electrically connected to the input terminals are formed;
- signal processing chips which have signal processing circuits which process the signals input through the first wiring patterns, output terminals to which the signals processed by the signal processing circuits are output, and wiring layers which are electrically connected to the second wiring patterns;
- and
- external connection portions which have first wiring electrically connected to the output terminals of the signal processing chips and second wiring electrically connected to the second wiring patterns formed on the substrate.
Dependencies are inferred from the claim text.