Process for Hybrid Integration of Focal Plane Arrays
AssigneePrinceton Lightwave, Inc.
InventorsMark Andrew Owens, Sabbir Sajjad Rangwala, Bora Muammer Onat, Domenick Salvemini
Life of this patent
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Abstract
A method for aligning a first substrate relative to a second substrate by enabling reflow of low-melting-temperature solder bumps is disclosed. Reflow of the solder bumps induces a force that moves one substrate relative to the other to improve alignment accuracy between bond pads located on each substrate. The method further enables reduction of surface oxide on the solder bumps that would otherwise inhibit reliable solder joint formation.
Claims19
A method for joining a first substrate and a second substrate, the method comprising:
- providing the first substrate, the first substrate including a first plurality of bonding sites, each having one of a first plurality of solder bumps;
- providing the second substrate, the second substrate including a second plurality of bonding sites, each having one of a second plurality of solder bumps;
- reducing a surface oxide on each of the first plurality of solder bumps and second plurality of solder bumps;
- reflowing the first plurality of solder bumps and second plurality of solder bumps;
- enabling physical contact between the first plurality of solder bumps and the second plurality of solder bumps to form a first plurality of solder joints;
- and
- enabling a reduction of the surface energy of each of the first plurality of solder joints.
A method for joining a first substrate having a first plurality of bonding sites arranged in a first arrangement and a second substrate having a second plurality of bonding sites arranged in a second arrangement that is complimentary with the first arrangement, each of the firs plurality of bonding sites and the second plurality of bonding sites having a solder bump disposed on it, the method comprising:
- positioning the first substrate and second substrate in a first chamber;
- reducing a surface oxide of the solder bumps;
- arranging the first substrate and second substrate such that each of the first plurality of bonding sites and a corresponding one of the second plurality of bonding sites is physically coupled via a solder joint comprising two solder bumps;
- enabling relative motion of the first substrate and second substrate;
- and
- enabling a reduction of the surface energy of the solder joints.
Dependencies are inferred from the claim text.