Electronic component mounting apparatus and method

An apparatus for mounting an electronic component on a substrate, the apparatus comprising:

• a rise-and-fall block;
• a first drive unit driving the rise-and-fall block along a path toward and from the substrate in a gross movement;
• a bonding tool for thermally bonding a bump on an electrode of the electronic component and the substrate with a thermally fused bond metal;
• a second drive unit driving the bonding tool along the path toward and from the substrate in a fine movement, the second drive unit incorporated in the rise-and-fall block and comprising a voice coil motor;
• a position detection unit for detecting a position of the bonding tool on the path, the position detection unit issuing a detection signal when the bump and a film of the bond metal are in contact with each other;
• and
• a control unit for controlling the bonding tool on the path with the first drive unit and the second drive unit, the control unit controlling the position detection unit for implementing a contact detecting step, a first reference position setting step, and a bonding tool position holding step, the control unit comprising:
• the contact detecting step of moving the bonding tool toward the substrate with the first drive unit in the gross movement and then moving the bonding tool further toward the substrate with the second drive unit in the fine movement and for determining whether or not the bump and the film are in contact with each other based on the detection signal;
• the first reference position setting step of setting the position of the bonding tool with respect to the substrate as a first reference position when the position detecting unit determines that the bump and the film are in contact with each other;
• and
• the bonding tool position holding step of bringing the bonding tool close to the substrate from the first reference position while heating the electronic component by controlling the second drive unit to provide a constant pressing force with which the bonding tool presses down the substrate and holding the position of the bonding tool in the direction getting close to and away from the substrate with the second drive unit based on the determination that bond metal between an electrode of the electronic component and an electrode of the substrate is thermally fused when the electronic component gets close to the substrate from the first reference position by a predetermined distance smaller than the thickness of the film of the bond metal.

A method of mounting an electronic component on a substrate using a mounting apparatus, the method comprising:

• preparing an apparatus comprising:
• a rise-and-fall block;
• a first drive unit driving the rise-and-fall block along a path toward and from the substrate in a gross movement;
• a bonding tool for thermally bonding a bump on an electrode of the electronic component and the substrate with a thermally fused bond metal;
• a second drive unit driving the bonding tool along the path toward and from the substrate in a fine movement, the second drive unit incorporated in the rise-and-fall block and comprising a voice coil motor;
• a position detection unit for detecting a position of the bonding tool on the path, the position detection unit issuing a detection signal when the bump and a film of the bond metal are in contact with each other;
• and
• a control unit for controlling the bonding tool on the path with the first drive unit and the second drive unit;
• moving the bonding tool toward the substrate with the first drive unit and then moving the bonding tool further toward the substrate with the second drive unit while determining with the position detection unit whether or not the bump and the film are in contact with each other based on the detection signal;
• setting the position of the bonding tool with respect to the substrate as a first reference position when it is determined in the step of determining that the bump and the film are in contact with each other;
• and
• bringing the bonding tool close to the substrate from the first reference position while heating the electronic component by controlling the second drive unit so as to provide a constant pressing force with which the bonding tool presses down the substrate and holding the position of the bonding tool in the direction getting close to and away from the substrate with the second drive unit based on the determination that bond metal between an electrode of the electronic component and an electrode of the substrate is thermally fused when the electronic component gets close to the substrate from the first reference position by a predetermined distance smaller than the thickness of a film of the bond metal.