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US 2013/0153555 A1Published application
Process for laser machining a layer system having a ceramic layer
OwnerStefan Werner Kiliani, Francis-Jurjen Ladruinventors
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Abstract
A process of laser machining a layer system is provided. The layer system has at least one metallic substrate and an outer ceramic layer. After laser machining the layer system, a layer thickness of the outer ceramic layer is reduced by a laser process and/or a smoothing process. The laser machining includes creating a plurality of passage holes using a diffuser.
Claims7
A process of laser machining a layer system, comprising:
- providing a layer system with at least one metallic substrate and an outer ceramic layer,
- laser machining the layer system,
- reducing a layer thickness of the outer ceramic layer,
- wherein the laser machining comprises creating a plurality of passage holes using a diffuser.
1 more element
The process as claimed in 2, wherein the layer thickness of the outer ceramic layer is reduced between 30 μm and 80 μm.
Dependencies are inferred from the claim text.