US 2013/0153378 A1 · HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE

Abstract

A MEMS structure and methods of manufacture. The method includes forming a sacrificial metal layer at a same level as a wiring layer, in a first dielectric material. The method further includes forming a metal switch at a same level as another wiring layer, in a second dielectric material. The method further includes providing at least one vent to expose the sacrificial metal layer. The method further includes removing the sacrificial metal layer to form a planar cavity, suspending the metal switch. The method further includes capping the at least one vent to hermetically seal the planar cavity.

Claims15

Dependent claims

A structure, comprising:

a lower planar cavity on a same level as a copper based wiring layer;
an upper planar cavity, extending to the lower planar cavity, on a same level as another copper based wiring layer;
a metal switch suspended between the lower planar cavity and the upper planar cavity;
and, one of:
a contact above the metal switch;
a contact below the metal switch;
and
an actuator at a same level as the metal switch.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

13/768,235Filed 15 Feb 2013

Priority

27 Jul 2010

Published

20 Jun 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H01H 59/00
Electrostatic relays
B81C 1/00182
Comprising flexible or deformable structures: arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a…
G06F 30/39
Circuit design: circuit design at the physical level
B81B 2201/014
Characterised by the shape: having a cantilever fixed on one side connected to one or more dimples

Horizontal coplanar switches and methods of manufacture

Life of this patent

Horizontal coplanar switches and methods of manufacture

Life of this patent

Abstract

Claims15