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US 2013/0153284 A1Published application
Lead Frame Package Structure with Low Electromagnetic Interference
AssigneeNovatek Microelectronics Corp.
InventorYu-Chang Pai
Life of this patent
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Abstract
A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.
Claims4
A lead frame package structure with low EMI, comprising:
- at least one die holder, for supporting a die;
- and
- at least one lead frame, each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal;
- wherein, a height of the lead is lower than a height of the first terminal and a height of the second terminal.
1 more element
Dependencies are inferred from the claim text.