Printed circuit board
AssigneeMsi Computer (Shenzhen) Co., Ltd.
InventorYi-Yen CHIANG
Life of this patent
Estimating the term…
Abstract
A printed circuit board including a board, a plating layer and a solder mask layer is provided. The board has a plated through hole for inserting a termination into the board. The plated through hole passes through a surface of the board. An annual ring around the plated through hole covers the surface of the board. The plating layer is formed in the plated through hole and electrically connected to the annual ring. The solder mask layer covers the surface of the board and a portion of the outer circle of the annual ring. The plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer.
Claims26
A printed circuit board, comprising:
- a board having a plated through hole for inserting a termination into the board, wherein the plated through hole passes through a surface of the board, and an annual ring around the plated through hole covers the surface of the board;
- a plating layer formed in the plated through hole and electrically connected to the annual ring;
- and
- a solder mask layer covering the surface of the board and a portion of an outer circle of the annual ring, wherein the plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer.
A printed circuit board, comprising:
- a board having a first plated through hole and a second plated through hole for inserting two terminations into the board, wherein the first and the second plated through holes respectively pass through a surface of the board, and a first and a second annual rings around the first and the second plated through holes respectively cover the surface of the board;
- a plating layer formed in the first and the second plated through holes and electrically connected to the first and the second annual rings respectively;
- and
- a solder mask layer covering the surface of the board and a portion of the outer circles of the first and the second annual rings, wherein the first plated through hole and other portion of the outer circle of the first annual ring are exposed in a first opening of the solder mask layer, and the second plated through hole and other portion of the outer circle of the second annual ring are exposed in a second opening of the solder mask layer.
Dependencies are inferred from the claim text.