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US 2013/0153281 A1Published application
Light source mount
AssigneeColorchip (Israel) Ltd.
InventorDavid Benbassat
Life of this patent
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Abstract
A mount for a semiconductor device, the mount comprising: an insulating substrate having first and second parallel face surfaces, an edge surface that connects the parallel surfaces and having formed therein a recess having an opening on the first face surface; an electrically conductive plug seated in the recess and having a first exposed surface on or near the edge surface and a second exposed surface on or near the first face surface.
Claims15
A mount for a semiconductor device, the mount comprising:
- an insulating substrate having first and second parallel face surfaces, an edge surface that connects the parallel surfaces and having formed therein a recess having an opening on the first face surface;
- an electrically conductive plug seated in the recess and having a first exposed surface on or near the edge surface and a second exposed surface on or near the first face surface.
A method of producing a mount for a semiconductor device, the method comprising:
- forming a recess in a substrate formed from an electrically insulating material and having first and second parallel face surfaces, wherein the recess has an opening on the first face surface;
- filling the recess with an electrically conductive material;
- and
- cutting the substrate to form an edge surface that connects the face surfaces and an exposed surface of the conductive material.
1 more element
Dependencies are inferred from the claim text.