Ball grid array package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJoo Sub Maeng
Life of this patent
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Abstract
Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. A uniform amount of solder balls is included in the pad patterns having the same shape, and thus the BGA package according to the present invention can prevent a short or open from occurring due to a conventional problem of an excessive or small amount of solder balls.
Claims12
A ball grid array (BGA) package comprising:
- a printed circuit board (PCB) in which a device is mounted via solder balls,
- wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape.
A method of manufacturing a BGA package, the method comprising:
- setting a mounting region of a PCB in which a device is mounted;
- and
- mounting the device on the mounting region via solder balls.
Dependencies are inferred from the claim text.