Electrically bonded arrays of transfer printed active components

A method of fabricating an active component array, the method comprising:

• providing at least one printable electronic component comprising an active layer including at least one active element on a first surface thereof and a conductive element on a second surface thereof opposite the first surface, the conductive element on the second surface being configured to provide an electrical coupling to the at least one active element on the first surface, wherein the at least one electronic component includes a broken portion of a tether adjacent a periphery thereof;
• and
• printing the at least one electronic component on a target substrate different from the active layer and including one or more electrical contacts on a surface thereof such that the conductive element on the second surface of the at least one electronic component is in contact with a respective one of the electrical contacts.