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US 2013/0153275 A1Published application
Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Gul Hyun, Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon
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Abstract
Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.
Claims16
A printed circuit board, comprising:
- a base substrate;
- circuit patterns formed in a circuit region on the base substrate;
- dummy patterns formed in a dummy region on the base substrate;
- and
- an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.
2 more elements
A method for manufacturing a printed circuit board, comprising:
- preparing a base substrate;
- forming circuit patterns and dummy patterns on the base substrate;
- and
- forming an insulating layer above the circuit patterns and the dummy patterns on the base substrate by a slit die coating method.
1 more element
Dependencies are inferred from the claim text.