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US 2013/0153274 A1Published application
Circuit board capable of preventing contact of a gold finger and solder
AssigneeWistron Corporation
InventorsChen-Liang Ku, Ko-Chin Lee
Life of this patent
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Abstract
A circuit board includes a substrate whereon a sunken portion is formed. The circuit board further includes a gold finger structure disposed inside the sunken portion. A height difference is formed between a top surface of the gold finger structure and a surface of the substrate substantially.
Claims9
A circuit board, comprising:
- a substrate whereon a sunken portion is formed;
- and
- a gold finger structure disposed inside the sunken portion on the substrate, and a height difference being formed between a top surface of the gold finger structure and a surface of the substrate substantially.
Dependencies are inferred from the claim text.