US 2013/0153273 A1 · STIFFENER AND METHOD FOR MANUFACTURING THE SAME

Abstract

Disclosed herein are a stiffener and a method for manufacturing the same. The method includes: forming a metal film on an upper surface or a lower surface of a base layer; forming a plurality of via holes penetrating the base layer and the metal film; and forming a first plating film covering an external surface including an inner surface of each of the via holes. The double-sided conductive stiffener according to the present invention can support the device by being disposed on the lower surface of the FPCB, and provide a ground structure of the device through the metal film without using the conductive bond or the conductive tape.

Claims13

Dependent claims

A stiffener, comprising:

a base layer;
and
a first plating film covering an external surface, passing through a plurality of via holes penetrating the base layer.

Dependencies are inferred from the claim text.

Facts

Application

13/661,206Filed 26 Oct 2012

Priority

KR 10-2011-013666516 Dec 2011

Published

20 Jun 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H05K 1/0215
Electrical arrangements not otherwise provided for: grounding of printed circuits by connection to external grounding means
H05K 3/0058
Apparatus or processes for manufacturing printed circuits: laminating printed circuit boards onto other substrates, e.g. metallic substrates
H05K 3/4038
Forming printed elements for providing electric connections to or between printed circuits: through-connections; Vertical interconnect access…
H05K 3/427
Characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern: initial plating of…

Stiffener and method for manufacturing the same

Life of this patent

Stiffener and method for manufacturing the same

Life of this patent

Abstract

Claims13