Printed circuit board
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsHSING-HUI CHIU, PEI-JYUN SU, SZE-YU LIN
Life of this patent
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Abstract
A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.
Claims6
A printed circuit board (PCB), comprising:
- a top layer comprising a top surface;
- a bottom layer comprising a bottom surface;
- a mounting hole vertically extending through the top layer and the bottom layer;
- a first copper ring located on the top surface of the top layer and around the mounting hole;
- a second copper ring located on the bottom surface of the bottom layer and around the mounting hole;
- a plurality of first pads positioned on the first copper ring;
- a plurality of second pads positioned on the second copper ring;
- and
- solder mask covering the first and second copper rings, without covering the first and second pads.
Dependencies are inferred from the claim text.