Printed circuit board and method of manufacturing the same

A printed circuit board, comprising:

• a base substrate including a first region and a second region;
• at least one first circuit pattern formed on the base substrate;
• at least one dummy pattern formed on the base substrate;
• an insulating layer formed on the first circuit pattern and the dummy pattern;
• and
• at least one second circuit pattern formed on the insulating layer,
• wherein in interval between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region meets the following Equation 2,
• a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the second region meets the following Equation 3, and
• a minimum height of the insulating layer formed in the first region is formed to be larger than a maximum height of the insulating layer formed in the second region.
• D
• 
• 
• 1
• ≤
• T
• 
• 
• 2
• T
• 
• 
• 1
• ×
• 200
• 1.2
• [
• Equation
• 
• 
• 2
• ]
• D
• 
• 
• 2
• >
• T
• 
• 
• 2
• T
• 
• 
• 1
• ×
• 200
• 1.2
• [
• Equation
• 
• 
• 3
• ]
• (Where D1 represents a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region, D2 represents a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region, T1 represents a thickness of the first circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the first circuit pattern or the dummy pattern.)

A method of manufacturing a printed circuit board, comprising:

• preparing a base substrate;
• forming at least one circuit pattern and at least one dummy pattern on the base substrate;
• and
• forming an insulating layer on the circuit pattern and the dummy pattern by a slit die coating method,
• wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1.
• D
• ≤
• T
• 
• 
• 2
• T
• 
• 
• 1
• ×
• 200
• 1.2
• [
• Equation
• 
• 
• 1
• ]
• (Where D represents a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns, T1 represents a thickness of the circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the circuit pattern or the dummy pattern.)

A method of manufacturing printed circuit board, comprising:

• preparing a base substrate including a first region and a second region;
• forming at least one first circuit pattern and at least one dummy pattern on the base substrate;
• forming an insulating layer on the first circuit pattern and the dummy pattern by a slit die coating method;
• and
• forming at least one second circuit pattern on the insulating layer,
• wherein a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region meets the following Equation 2,
• a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the second region meets the following Equation 3, and
• a minimum height of the insulating layer formed in the first region is formed to be larger than a maximum height of the insulating layer formed in the second region.
• D
• 
• 
• 1
• ≤
• T
• 
• 
• 2
• T
• 
• 
• 1
• ×
• 200
• 1.2
• [
• Equation
• 
• 
• 2
• ]
• D
• 
• 
• 2
• >
• T
• 
• 
• 2
• T
• 
• 
• 1
• ×
• 200
• 1.2
• [
• Equation
• 
• 
• 3
• ]
• (Where D1 represents a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region, D2 represents a distance between adjacent patterns to each other among the first circuit patterns and the dummy patterns in the first region, T1 represents a thickness of the first circuit pattern or the dummy pattern, and T2 is a maximum thickness formed on the first circuit pattern or the dummy pattern.)