Dual Heat Sinks For Distributing A Thermal Load

A method for installing a dual heat sink for distributing a thermal load, the method comprising:

• aligning a dual heat sink between a first integrated circuit of a first board and a second integrated circuit of a second board;
• the dual heat sink including:
• a top base to couple with the first integrated circuit and to receive a first thermal load from the first integrated circuit;
• a bottom base to couple with the second integrated circuit and to receive a second thermal load from the second integrated circuit;
• and
• a thermal dissipating structure coupled between the top base and the bottom base, the thermal dissipating structure to receive and distribute the first thermal load and the second thermal load from the top base and the bottom base;
• increasing a height of the thermal dissipating structure until the top base is in contact with the first integrated circuit and the bottom base is in contact with the second integrated circuit.

An apparatus for distributing a thermal load, the apparatus comprising:

• a first integrated circuit coupled to a first board;
• a second integrated circuit coupled to a second board;
• a dual heat sink coupled between the first integrated circuit and the second integrated circuit;
• the dual heat sink comprising:
• a top base to couple with the first integrated circuit and to receive a first thermal load from the first integrated circuit;
• a bottom base to couple with the second integrated circuit and to receive a second thermal load from the second integrated circuit;
• and
• a thermal dissipating structure coupled between the top base and the bottom base, the thermal dissipating structure to receive and distribute the first thermal load and the second thermal load from the top base and the bottom base;
• wherein a height of the thermal dissipating structure is adjustable so as to change a distance separating the top base and the bottom base.