Joint system, substrate processing system, and joint method

A joint system joining a processing target substrate and a supporting substrate together, comprising:

• a joint processing station performing predetermined processing on the processing target substrate and the supporting substrate;
• and
• a transfer-in/out station transferring the processing target substrate, the supporting substrate or a superposed substrate in which the processing target substrate and the supporting substrate are joined together into/from said joint processing station,
• wherein said joint processing station comprises:
• a coating unit applying an adhesive to the processing target substrate or the supporting substrate;
• a first heat processing unit heating the processing target substrate or the supporting substrate coated with the adhesive to a first temperature;
• a second heat processing unit further heating the processing target substrate or the supporting substrate which has been heated to the first temperature to a second temperature higher than the first temperature;
• a joint unit joining the processing target substrate and the supporting substrate together via the adhesive by pressing the processing target substrate and the supporting substrate;
• and
• a transfer region for transferring the processing target substrate, the supporting substrate or the superposed substrate to said coating unit, said first heat processing unit, said second heat processing unit, and said joint unit.

A substrate processing system comprising a joint system joining a processing target substrate and a supporting substrate together,

• wherein said joint system comprises:
• a joint processing station performing predetermined processing on the processing target substrate and the supporting substrate;
• and
• a transfer-in/out station transferring the processing target substrate, the supporting substrate or a superposed substrate in which the processing target substrate and the supporting substrate are joined together into/from said joint processing station,
• wherein said joint processing station comprises:
• a coating unit applying an adhesive to the processing target substrate or the supporting substrate;
• a first heat processing unit heating the processing target substrate or the supporting substrate coated with the adhesive to a first temperature;
• a second heat processing unit further heating the processing target substrate or the supporting substrate which has been heated to the first temperature to a second temperature higher than the first temperature;
• a joint unit joining the processing target substrate and the supporting substrate together via the adhesive by pressing the processing target substrate and the supporting substrate;
• and
• a transfer region for transferring the processing target substrate, the supporting substrate or the superposed substrate to said coating unit, said first heat processing unit, said second heat processing unit, and said joint unit,
• wherein said substrate processing system further comprises a separation system separating the superposed substrate joined by said joint system into the processing target substrate and the supporting substrate,
• wherein said separation system comprises:
• a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate;
• a transfer-in/out station transferring the processing target substrate, the supporting substrate or the superposed substrate into/from said separation processing station;
• and
• a transfer unit transferring the processing target substrate, the supporting substrate or the superposed substrate between said separation processing station and said transfer-in/out station, and
• wherein said separation processing station comprises:
• a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate;
• a first cleaning unit cleaning the processing target substrate separated in said separation unit;
• and
• a second cleaning unit cleaning the supporting substrate separated in said separation unit.

A joint method of joining a processing target substrate and a supporting substrate together using a joint system,

• wherein the joint system comprises:
• a joint processing station comprising a coating unit applying an adhesive to the processing target substrate or the supporting substrate, a first heat processing unit heating the processing target substrate or the supporting substrate coated with the adhesive to a first temperature, a second heat processing unit further heating the processing target substrate or the supporting substrate which has been heated to the first temperature to a second temperature higher than the first temperature, a joint unit joining the processing target substrate and the supporting substrate together via the adhesive by pressing the processing target substrate and the supporting substrate, and a transfer region for transferring the processing target substrate, the supporting substrate or the superposed substrate to the coating unit, the first heat processing unit, the second heat processing unit, and the joint unit;
• and
• a transfer-in/out station transferring the processing target substrate, the supporting substrate or the superposed substrate into/from the joint processing station, and
• wherein said joint method comprises:
• an adhesive coating step of applying the adhesive to the processing target substrate or the supporting substrate in the coating unit, then heating the processing target substrate or the supporting substrate to the first temperature in the first heat processing unit, and further heating the processing target substrate or the supporting substrate to the second temperature in the second heat processing unit;
• and
• a joint step of then joining, in the joint unit, the processing target substrate or the supporting substrate coated with the adhesive in said adhesive coating step with the supporting substrate or the processing target.