Solar Cell Flip Chip Package Structure and Method for Manufacturing the same
AssigneeTong Hsing Electronic Industries, Ltd.
InventorShao-Pin Ru
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Abstract
The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
Claims20
A solar cell flip chip package structure, comprising:
- a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface;
- a conducting layer disposed on the first surface of the substrate;
- a solar cell flip chip bonded on the conducting layer;
- a transparent layer attached on the second surface of the substrate;
- and
- a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
A solar cell flip chip package structure, comprising:
- a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface;
- a conducting layer disposed on the first surface of the substrate;
- a solar cell flip chip bonded on the conducting layer;
- a transparent layer formed by glass attached on the second surface of the substrate;
- and
- a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
A method for manufacturing solar cell flip chip package structure, comprising:
- forming a rectangular opening from a substrate;
- covering a first conducting layer top surface of the substrate by electroplating,
- plating a surface finish layer on the first conducting layer;
- planting bumps on the surface finish layer for electrically conducting to a solar cell flip chip;
- dispensing glue on the second surface of the substrate;
- and
- adhering a transparent layer to the second surface of the substrate for covering on the rectangular opening.
Dependencies are inferred from the claim text.