Large aluminum nitride crystals with reduced defects and methods of making them
AssigneeCrystal IS, Inc.
InventorsRobert T. Bondokov, Kenneth E. Morgan, Glen A. Slack, Leo Schowalter
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AssigneeCrystal IS, Inc.
InventorsRobert T. Bondokov, Kenneth E. Morgan, Glen A. Slack, Leo Schowalter
Estimating the term…
Reducing the microvoid (MV) density in AlN ameliorates numerous problems related to cracking during crystal growth, etch pit generation during the polishing, reduction of the optical transparency in an AlN wafer, and, possibly, growth pit formation during epitaxial growth of AlN and/or AlGaN. This facilitates practical crystal production strategies and the formation of large, bulk AlN crystals with low defect densities—e.g., a dislocation density below 104 cm−2 and an inclusion density below 104 cm−3 and/or a MV density below 104 cm−3.
1-38. (canceled)
A method of growing single-crystal AlN, the method comprising:
The method of claim 1, wherein the crystal growth enclosure comprises at least one of tantalum and carbon, and a growth temperature is less than approximately 2750° C.
The method of claim 1, wherein a temperature gradient of greater than approximately 5° C./cm and less than approximately 100° C./cm is maintained along a length of the crystal growth enclosure while depositing the vapor.
Dependencies are inferred from the claim text.