Measuring apparatus and measuring method for metallic microstructures or material properties
AssigneeToshiba Mitsubishi-Electric Industrial Systems Corporation
InventorMitsuhiko Sano
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AssigneeToshiba Mitsubishi-Electric Industrial Systems Corporation
InventorMitsuhiko Sano
Estimating the term…
A pulse laser oscillator (11) outputs a first laser beam, a beam splitter splitting the first laser beam into split beams, optical paths (12, 13, 14, 15, 16) propagating light of split beams split, respectively, taking different times for light propagation thereof, a condenser superimposing light of split beams propagated through the optical paths, respectively, on an identical spot of a measuring material (100), for irradiation therewith, a laser interferometer (30) irradiating the measuring material (100) with light of a second laser beam, having light intensity variations resulted from interferences between reference light and light of the second laser beam reflected or scattered, as bases to detect ultrasonic waves energized by light of the first laser beam and transmitted in the measuring material (100), a waveform analyzer (32) calculating a metallic microstructure or a material property of the measuring material (100) based on ultrasonic waves.
A measuring apparatus for metallic microstructures or material properties, comprising:
A measuring method for metallic microstructures or material properties, comprising:
Dependencies are inferred from the claim text.