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US 2013/0128108 A1Published application
Camera module
AssigneeLG Innotek Co., Ltd.
InventorsHyun Ah OH, Youn Baek JEONG, Se Jin LEE
Life of this patent
Estimating the term…
Abstract
Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
Claims22
A camera module, the camera module comprising:
- a PCB (Printed Circuit Board) mounted with an image sensor;
- a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor;
- an IRCF (Infrared Cut Filter) installed at an upper surface of the base;
- and an adhesive member fixing the IRCF to the base.
1 more element
A camera module, the camera module comprising:
- some exemplary embodiments, PCB (Printed Circuit Board) mounted with an image sensor;
- a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor;
- an IRCF (Infrared Cut Filter) installed at an upper surface of the base;
- a dust trap resin cut rib protrusively formed at a periphery of the window opposite to the PCB;
- and a dust trap resin coated on a surface opposite the PCB of the base.
2 more elements
A camera module, the camera module comprising:
- one or more sheets of lenses receiving an optical image of an object;
- an image sensor converting the optical image of the object from a lens to an electrical signal, formed at an upper surface with a dam, and formed at an upper marginal area of the image sensor with a dust trap from the dam;
- and a substrate mounted with the image sensor.
Dependencies are inferred from the claim text.