Scanning probe microscopy-based metrology tool with a vacuum partition

Abstract

A method of monitoring of semiconductor processes is provided that includes monitoring the processes using a scanning probe microscope (SPM), where a first partition is located below a second partition, where the second partition is hermetically isolated from the first partition, where a SPM probe tip of the SPM is disposed in the first partition, where a remaining portion of the SPM is disposed in the second partition that is hermetically isolated from the first partition, and where the semiconductor processes may occur in either the first partition or a third partition.

Dependencies are inferred from the claim text.