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US 2013/0095709 A1Published application
Pins for semiconductor device
AssigneeNan Ya Pcb Corp.
InventorsShih-Tsung Lin, Yu-Shi Wong, Tzu-Yuan Hsu, Yu-Wei Chen
Life of this patent
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Abstract
A pin for a semiconductor device is disclosed. A connection head includes a plurality of curved protruded ribs and a plurality of recessed grooves. The curved protruded ribs and recessed grooves are alternately arranged. The curved protruded ribs radially extend from the center of the connection head. A pin stem is connected to the connection head.
Claims10
A pin for a semiconductor device, comprising:
- a connection head comprising a plurality of curved protruded ribs and a plurality of recessed grooves, wherein the curved protruded ribs and recessed grooves are alternately arranged, and the curved protruded ribs radially extend from the center of the connection head;
- and
- a pin stem connected to the connection head.
A pin for a semiconductor device, comprising:
- a connection head comprising a flat portion, a round protruded portion, a plurality of spiral protruded ribs, and a plurality of recessed grooves, wherein the flat portion is formed on the center of the connection head, the round protruded portion is formed on the flat portion, the spiral protruded ribs and recessed grooves are alternately arranged, and the spiral protruded ribs radially extend from the flat portion;
- and
- a pin stem connected to the connection head.
Dependencies are inferred from the claim text.