Methods for Forming 3DIC Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMeng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMeng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
Estimating the term…
A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
A method comprising:
A method comprising:
14-20. (canceled)
A method comprising:
Dependencies are inferred from the claim text.