Fabrication Method for ZnO Thin Film Transistors Using Etch-stop Layer
AssigneeGovernment of the United States as Represented by the Secretary of the Air Force
InventorsBurhan Bayraktaroglu, Kevin Leedy
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AssigneeGovernment of the United States as Represented by the Secretary of the Air Force
InventorsBurhan Bayraktaroglu, Kevin Leedy
Estimating the term…
A method is provided for fabricating a thin film transistor. A plurality of layers is deposited on a substrate. The plurality of layers includes a conductive gate contact layer, a gate insulator layer, an undoped channel layer, an etch-stop layer, and a conductive contact layer. The etch-stop layer is positioned between the conductive contact layer and the undoped channel layer. A portion of the conductive contact layer is selectively removed while removal of a portion of the undoped channel layer is prevented by the etch-stop layer during the selective removal. A portion of the etch-stop layer is selectively removed and an exposed portion of the etch-stop layer is converted from a conductor to an insulator by oxidizing the exposed portion of the etch-stop layer in air. A portion of remaining layers of the plurality of layers is selectively removed to form the thin film transistor.
A method of fabricating a transparent thin film transistor, the method comprising:
A method of fabricating a thin film transistor from a plurality of layers deposited on a substrate, the plurality of layers including a conductive gate contact layer, a gate insulator layer, an undoped channel layer, an etch-stop layer, and a conductive contact layer, where the etch-stop layer is positioned between the conductive contact layer and the undoped channel layer, the method comprising:
A method of fabricating a reduced parasitic capacitance transistor, the method comprising:
Dependencies are inferred from the claim text.