Method for manufacturing led
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorCHIEH-LING CHANG
Life of this patent
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Abstract
A method for manufacturing an LED is disclosed. Firstly, a base with two leads is provided. The base has a cavity defined in a top face thereof and two holes defined in two lateral faces thereof. The two holes communicate the cavity with an outside environment. A chip is fixed in the cavity and electrically connected to the two leads. A cover is placed on the top face of the base to cover the cavity. An encapsulation liquid is filled into the cavity through one hole until the encapsulation liquid joins a bottom face of the cover. Finally, the encapsulation liquid is cured to form an encapsulant. A top face of the cover functions as a light emergent face of the LED.
Claims19
A method for manufacturing an LED (light emitting diode), comprising:
- providing a base with two leads fixed to the base, the base defining a cavity in a top face thereof and a hole communicating the cavity with an outside environment;
- fixing a light emitting chip in the cavity and electrically connecting the chip with the two leads;
- attaching a cover on the top face of the base to cover the cavity, wherein the cover has a top face functioning as a light emergent face of the LED;
- filling an encapsulation liquid into the cavity through the hole until the encapsulation liquid joining a bottom face of the cover;
- and
- curing the encapsulation liquid to an encapsulant sealing the chip.
Dependencies are inferred from the claim text.