Transformer signal coupling for flip-chip integration

A method for matching impedance in an RF circuit fabricated using flip-chip techniques, comprising:

• passing an RF input signal through a first inductor formed using a passive process;
• inducing a time varying magnetic flux in proximity to a second inductor formed using an active process;
• and
• passing an RF signal induced by the time varying magnetic flux through the second inductor.

A method for providing an inductive coupling between dies, comprising:

• step for fabricating a first inductor on a first die using a passive process;
• step for fabricating a second inductor on a second die using a semiconductor process;
• and
• step for assembling each die so the first and second inductor are configured as a transformer.

A method for matching impedance in an RF circuit fabricated using flip-chip techniques, comprising:

• step for passing an RF input signal through a first inductor formed using a passive process;
• step for inducing a time varying magnetic flux in proximity to a second inductor formed using an active process;
• and
• step for passing an RF signal induced by the time varying magnetic flux through the second inductor.