Interfaces and die packages, and appartuses including the same
AssigneeMicron Technology, Inc.
InventorOh Seung Min
Life of this patent
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AssigneeMicron Technology, Inc.
InventorOh Seung Min
Estimating the term…
A memory device includes a die package including a plurality of memory dies, an interface including an interface circuit, and a memory controller to control the interface with control data received from at least one die. The interface is to divide and multiplex an IO channel between the package and the controller into more than one channel using the data received from the at least one die. The interface includes a control input buffer to receive an enable signal through a control pad, a first input buffer to receive first data through a first IO pad in response to a first state of the enable signal, and a second input buffer to receive second data through a second IO pad in response to a second state of the enable signal. The interface further includes an input multiplexer to multiplex the first data and the second data to provide input data.
An apparatus, comprising:
An apparatus, comprising:
An interface, comprising:
A memory device, comprising:
An interface, comprising:
A memory device, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.