Heat removal in compact computing systems

A low profile heat removal assembly, comprising:

• a heat pipe configured to transfer heat from a heat source to an external heat sink;
• a slug having a bottom surface in direct thermal contact with the heat pipe;
• and
• a stage comprising a fastener opening configured to accept a fastener having a size and shape in accordance with the fastener opening, the fastener configured to mechanically couple the stage to a support structure,
• wherein the heat pipe is disposed laterally with respect to the heat source, thereby allowing efficient heat transfer between the heat source and the heat pipe.

A method for removing heat generated by an electrical component, the electrical component mounted to a substrate, the substrate mounted to a support structure, the method comprising:

• providing a bottom surface of a slug in direct thermal contact with the electrical component;
• providing a heat pipe in direct thermal contact with the bottom surface of the slug, wherein the heat pipe is laterally disposed with respect to the electrical component;
• and
• securing the slug to the motherboard by a stage, the stage comprising a fastener opening configured to accept a fastener having a size and shape in accordance with the fastener opening, the fastener configured to mechanically couples the stage to the support structure.

An electronic device, comprising:

• a printed circuit board (PCB);
• an integrated circuit coupled to the PCB;
• a slug having a bottom surface in direct thermal contact with a top surface of the integrated circuit;
• a heat pipe in direct thermal contact with the bottom surface of the slug, the heat pipe configured to transfer heat generated by the integrated circuit to an external heat sink in thermal contact with the heat pipe, wherein the heat pipe is disposed laterally with respect to the integrated circuit;
• a stage comprising a plurality of fastener openings, and a slug attachment feature configured to couple the stage to the slug;
• and
• a plurality of fasteners having a size and shape in accordance with the fastener openings, each of the plurality of fasteners configured to secure the stage to the printed circuit board.