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US 2013/0093556 A1Published application
Multilayered ceramic electronic component and fabrication method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorBong Sup LIM
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Abstract
There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
Claims31
A multilayered ceramic electronic component comprising:
- a ceramic main body including outer electrodes formed thereon;
- conductive patterns laminated within the ceramic main body;
- and
- first dummy patterns disposed on cover areas of the ceramic main body, electrically separated from the conductive patterns, and exposed outwardly from the ceramic main body.
1 more element
A method of fabricating a multilayered ceramic electronic component, the method comprising:
- forming a first dummy pattern on a ceramic green sheet to prepare a first ceramic green sheet;
- forming a conductive pattern and a second dummy pattern on another ceramic green sheet to prepare a second ceramic green sheet;
- laminating the first and second green sheets to prepare a laminate;
- cutting the laminate such that the first and second dummy patterns are exposed to the outside, and firing the cut laminate;
- and
- forming outer electrodes on the fired laminate.
3 more elements
Dependencies are inferred from the claim text.