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US 2013/0093532 A1Published application
Flexible printed circuit board
AssigneeFujikura Ltd.
InventorsHirohito Watanabe, Masakazu Sato, Taiji Ogawa
Life of this patent
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Abstract
A flexible printed circuit board including: a base substrate; a pad formed on one surface side of the base substrate; and a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a ground-removed portion, the ground-removed portion being formed at a position facing the pad via the base substrate so as to be of similar shape to the pad and have an outer shape extended 100±50 μm outwardly from an outer shape of the pad.
Claims12
A flexible printed circuit board including:
- a base substrate;
- a pad formed on one surface side of the base substrate;
- and
- a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a ground-removed portion, the ground-removed portion being formed at a position facing the pad via the base substrate so as to be of similar shape to the pad and have an outer shape extended 100±50 μm outwardly from an outer shape of the pad.
1 more element
A flexible printed circuit board including:
- a base substrate;
- a plurality of pads formed on one surface side of the base substrate;
- and
- a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a plurality of ground-removed portions, the ground-removed portions being formed at positions facing the pads via the base substrate so as to be of similar shapes to the pads and have outer shapes each extended 100±50 μm outwardly from outer shapes of the pads.
1 more element
Dependencies are inferred from the claim text.