Connecting device, semiconductor wafer test apparatus comprising same, and connecting method
AssigneeAdvantest Corporation
InventorHiroshi Sakata
Life of this patent
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Abstract
A connecting device electrically connects a performance board which has PB terminals and a test head, and includes a sub board which is electrically connected to the test head and has sub terminals which face the PB terminals, a sealing mechanism which forms a sealed space between the sub board and the performance board, and a pressure reducing device which reduces the pressure of the sealed space. The pressure reducing device reduces the pressure of the sealed space so that the performance board and the sub board approach each other and the PB terminals and the sub terminals contact.
Claims19
A connecting device which electrically connects a circuit board which has first terminals and a test head, comprising:
- a connection board which is electrically connected to the test head and has second terminals which face the first terminals;
- a sealing device which forms a sealed space between the connection board and the circuit board;
- and
- a pressure reducing device which reduces the pressure of the sealed space, wherein
- the pressure reducing device reduces the pressure of the sealed space so that the circuit board and the connection board approach each other and the first terminals and the second terminals contact.
A connecting method of electrically connecting a circuit board which has first terminals and a test head, comprising:
- making second terminals of a connection board face the first terminals, the connection board which is electrically connected with a test head;
- forming a sealed space between the circuit board and the connection board;
- and
- reducing the pressure of the sealed space so that the circuit board and the connection board approach each other and the first terminals and the second terminals contact.
Dependencies are inferred from the claim text.