Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMasateru Saigusa, Masamitsu Oshikiri
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Abstract
According to one embodiment, a semiconductor device is provided. The semiconductor device includes a package substrate; a first semiconductor chip mounted on the package substrate and adapted to include a plurality of first bonding pads arranged in a first order on an upper surface; a second semiconductor chip arranged on the first semiconductor chip and adapted to include a plurality of second bonding pads arranged in the first order on an upper surface; and first bonding wires configured to connect each of the plurality of first bonding pads and the plurality of second bonding pads.
Claims17
A semiconductor device comprising:
- a package substrate;
- a first semiconductor chip mounted on the package substrate and included a plurality of first bonding pads individually assigned with a function and arranged in a first order on an upper surface;
- a second semiconductor chip, which outer shape is smaller than the first semiconductor chip, arranged on the first semiconductor chip and included a plurality of second bonding pads assigned with a function corresponding to each of the plurality of first bonding pads and arranged to line in the first order on an upper surface;
- and
- first bonding wires configured to connect each of the plurality of first bonding pads and the plurality of second bonding pads.
Dependencies are inferred from the claim text.