Silicone resin sheet, cured sheet, and light emitting diode device and producing method thereof
AssigneeNitto Denko Corporation
InventorsRyuichi KIMURA, Hiroyuki KATAYAMA
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Abstract
A silicone resin sheet is formed from a resin composition containing a thermosetting silicone resin and microparticles. The complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.; a rate of frequency increase of 10 Hz/min; and a distortion of 1% in a shear mode.
Claims5
A silicone resin sheet formed from:
- a resin composition containing a thermosetting silicone resin and microparticles, wherein
- the complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.;
- a rate of frequency increase of 10 Hz/min;
- and a distortion of 1% in a shear mode.
A cured sheet obtained by cuing a silicone resin sheet, wherein
- the silicone resin sheet is formed from:
- a resin composition containing a thermosetting silicone resin and microparticles, and
- the complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.;
- a rate of frequency increase of 10 Hz/min;
- and a distortion of 1% in a shear mode.
A light emitting diode device comprising:
- a light emitting diode element and
- a cured sheet which encapsulates the light emitting diode element, wherein
- the cured sheet is obtained by cuing a silicone resin sheet, and
- the silicone resin sheet is formed from:
- a resin composition containing a thermosetting silicone resin and microparticles, and
- the complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.;
- a rate of frequency increase of 10 Hz/min;
- and a distortion of 1% in a shear mode.
A method for producing a light emitting diode device comprising the steps of:
- embedding a light emitting diode element by a silicone resin sheet and
- encapsulating the light emitting diode element by curing the silicone resin sheet, wherein the silicone resin sheet is formed from:
- a resin composition containing a thermosetting silicone resin and microparticles, and
- the complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.;
- a rate of frequency increase of 10 Hz/min;
- and a distortion of 1% in a shear mode.
Dependencies are inferred from the claim text.