US 2013/0092973 A1Published application

Encapsulating sheet and optical semiconductor element device

AssigneeNitto Denko Corporation

InventorsTakashi KONDO, Hiroki KONO, Yuki EBE

Life of this patent

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Abstract

An encapsulating sheet is formed from an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, and the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %.

Claims4

Dependent claims

An encapsulating sheet formed from:

an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, wherein
the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %.

Dependencies are inferred from the claim text.

Facts

Application: 13/650,761Filed 12 Oct 2012
Priority: JP 2011-22892118 Oct 2011
Published: 18 Apr 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification20 codes

H10H 20/854
Encapsulations: characterised by their material, e.g. epoxy or silicone resins
C08L 83/04
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with…
C08G 77/045
Polysiloxanes: containing less than 25 silicon atoms
C08G 77/12
Polysiloxanes: containing silicon bound to hydrogen

Family

US 9,312,456 B2Related patent
US 9,349,927 B2Related patent
US 2013/0092973 A1This patent

From the US filing history. Foreign family members aren’t listed.

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