Probe Pad Design for 3DIC Package Yield Analysis

A device comprising:

• an interposer comprising:
• a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides;
• a first probe pad and a second probe pad at the first surface;
• a daisy chain electrically coupling the first and the second probe pads with each other;
• and
• a first through-via in the interposer and electrically coupled to the first and the second probe pads.

A method comprising:

• probing a first probe pad and a second probe pad to determine a connection status of a daisy chain electrically coupled between the first and the second probe pads, wherein the first and the second probe pads are on a first surface of an interposer, and wherein the interposer comprises:
• a through-via;
• and
• an electrical connector at the first surface of the interposer and electrically coupled to the through-via and the first and the second probe pads, wherein the electrical connector is configured to bond the interposer to an additional package component.