Film-forming device and film-forming method
AssigneeUlvac, Inc.
InventorsYoshinori Fujii, Shinya Nakamura
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Abstract
A film-forming device is provided, including: a chamber in which a substrate is disposed; a target, disposed within the chamber, which contains a material from which a film is formed; a substrate-supporting table disposed inside the chamber; driving unit that rotates the substrate-supporting table; a sputtering cathode that causes sputtered particles to be incident on the substrate from an oblique direction; and a control unit that controls the driving unit by setting a rotation period so that a sputtering film formation time required to form a film having a desired thickness is an integer multiple of a rotation period of the substrate-supporting table.
Claims6
A film-forming device comprising:
- a chamber in which a substrate is disposed, the substrate having a film to be formed thereon through sputtering film formation;
- a target, disposed within the chamber, which contains a material from which the film is formed;
- a substrate-supporting table disposed inside the chamber;
- a driving unit that rotates the substrate-supporting table;
- a sputtering cathode on which the target is mounted and which causes sputtered particles to be incident on the substrate on the substrate-supporting table from an oblique direction;
- and
- a control unit that controls the driving unit by setting a rotation period so that a sputtering film formation time for which the substrate-supporting table is rotated at a predetermined rotation period is an integer multiple of a rotation period of the substrate-supporting table, the sputtering film formation time being required to form a film having a desired thickness.
A film-forming method making use of a film-forming device, including a chamber in which a substrate is disposed, the substrate having a film to be formed thereon through sputtering film formation, a target, disposed within the chamber, which contains a material from which the film is formed, a substrate-supporting table disposed inside the chamber, driving unit that rotates the substrate-supporting table, and a sputtering cathode on which the target is mounted and which causes sputtered particles to be incident on the substrate on the substrate-supporting table from an oblique direction, the method comprising:
- controlling the driving unit by setting a rotation period so that a sputtering film formation time for which the substrate-supporting table is rotated at a predetermined rotation period is an integer multiple of a rotation period of the substrate-supporting table, the sputtering film formation time being required to form a film having a desired thickness.
Dependencies are inferred from the claim text.