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US 2013/0091999 A1Published application
Apparatus and Process for Cutting Adhesive Labels
AssigneeAvery Dennison Corporation
InventorsAlan GREEN, Dennis Rene BENOIT
Life of this patent
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Abstract
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
Claims23
An apparatus for forming a cut adhesive backed label on a liner comprising:
- an optional separator station for separating a liner from a facestock and adhesive layer;
- a cutting station for forming a plurality of cut adhesive backed labels and a surrounding matrix from the facestock and the adhesive layer, wherein the cutting station comprises a flexible rotary die and an anvil wherein the flexible rotary die comprises a die plate that is fastened to a mounting cylinder, and a means for cooling the adhesive prior to cutting the facestock and adhesive.
A system for producing cut adhesive backed labels on a liner comprising:
- a) a web of label stock comprising a facestock having a first side and a second side, an adhesive layer adhered to a first side of the facestock and, optionally, a release liner adhered to an exposed surface of the adhesive layer;
- i) an apparatus for forming a cut adhesive backed label on a liner of a web of labelstock as set forth in a) comprising an optional separator station for separating a liner if present from a facestock and adhesive layer;
- and
- ii) a cutting station for forming a plurality of cut adhesive backed labels and a surrounding matrix from the facestock and the adhesive layer, wherein the cutting station comprises a flexible rotary die and an anvil wherein the flexible rotary die comprises a die plate that is fastened to a mounting cylinder, and a means for cooling the adhesive prior to cutting the facestock and adhesive.
1 more element
Dependencies are inferred from the claim text.