Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsOsamu Oto, Takahiro Tsurudo, Kenichi Matoba, Jumpei Sato
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AssigneeKabushiki Kaisha Toshiba
InventorsOsamu Oto, Takahiro Tsurudo, Kenichi Matoba, Jumpei Sato
Estimating the term…
In one embodiment, a semiconductor device includes a first wiring provided in a first wiring layer along a first direction, a second wiring provided in a second wiring layer along a second direction orthogonal to the first direction, the second wiring intersecting with the first wiring at a first intersect portion, and a third wiring provided close to and along the second wiring in the second wiring layer, the third wiring intersecting with the first wiring at a second intersect portion, wherein a distance between the second wiring in the first intersection portion and the third wiring in the second intersection portion is narrower than a distance between the second wiring another than the first intersection portion and the third wiring another than the second intersection portion.
A semiconductor device, comprising:
The semiconductor device of claim 11, wherein
Dependencies are inferred from the claim text.