Integrated circuit packaging system with external wire connection and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorDaeSik Choi
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit to the package carrier; forming an external wire on the package carrier and adjacent to the integrated circuit; forming an encapsulation on the package carrier over the external wire; and forming a hole in the encapsulation with the external wire and a portion of the package carrier exposed from the encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package carrier;
- mounting an integrated circuit to the package carrier;
- forming an external wire on the package carrier and adjacent to the integrated circuit;
- forming an encapsulation on the package carrier over the external wire;
- and
- forming a hole in the encapsulation with the external wire and a portion of the package carrier exposed from the encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package carrier;
- mounting an integrated circuit to the package carrier;
- forming an external wire on the package carrier and adjacent to the integrated circuit;
- forming an encapsulation on the package carrier over the external wire;
- and
- forming a hole in the encapsulation exposing a portion of the package carrier and exposing the external wire below the top horizontal surface of the encapsulation.
An integrated circuit packaging system comprising:
- a package carrier;
- an integrated circuit on the package carrier;
- an external wire on the package carrier and adjacent to the integrated circuit;
- and
- an encapsulation on the package carrier, the encapsulation having a hole exposing the external wire and a portion of the package carrier.
Dependencies are inferred from the claim text.