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US 2013/0075914 A1Published application
Semiconductor element
AssigneeNichia Corporation
InventorsTakashi ICHIHARA, Yasuhiro MIKI
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Abstract
There is provided a semiconductor element including a semiconductor layer, a translucent electrode which is formed on the semiconductor layer, and a pad electrode which is formed on the translucent electrode, wherein the translucent electrode includes a recessed part on which the pad electrode is mounted, and wherein a thickness of a bottom surface of the recessed part of the translucent electrode is more than 0% of and equal to or less than 70% of a thickness of a part of the translucent electrode other than the recessed part.
Claims11
A semiconductor element comprising
- a semiconductor layer,
- a translucent electrode which is formed on the semiconductor layer, and
- a pad electrode which is formed on the translucent electrode, wherein
- the translucent electrode includes a recessed part on which the pad electrode is mounted, and wherein
- a thickness of a bottom surface of the recessed part of the translucent electrode is more than 0% of and equal to or less than 70% of a thickness of a part of the translucent electrode other than the recessed part.
2 more elements
Dependencies are inferred from the claim text.