Coaxial power module
AssigneeGeneral Electric Company
InventorsEladio Clemente Delgado, Arun Virupaksha Gowda, Antonio Caiafa, Brian Lynn Rowden, Ljubisa Dragoljub Stevanovic, Richard Alfred Beaupre
Life of this patent
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Abstract
A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
Claims20
A power module comprising:
- a cylindrical electromagnetic interference (EMI) shield;
- one or more semiconductor die holding structures, each die holding structure comprising a substantially cylindrical outer profile and a central axis, wherein each die holding structure is disposed within the cylindrical EMI shield;
- and
- a plurality of semiconductor devices mounted to each die holding structure to form a substantially symmetric die mounting pattern with respect to the central axis of the die holding structure.
A power module comprising:
- a cylindrical electromagnetic interference (EMI) shield;
- one or more circumferential wrapped semiconductor die holding structures, each die holding structure comprising a substantially cylindrical outer profile and a central axis, wherein each die holding structure is disposed within the cylindrical EMI shield;
- and
- a plurality of semiconductor devices mounted to each die holding structure to form a substantially symmetric die mounting pattern with respect to the central axis of the die holding structure.
A power module comprising:
- a cylindrical electromagnetic interference (EMI) shield;
- one or more multi-stack radial semiconductor die holding structures, each die holding structure comprising a substantially cylindrical outer profile and a central axis, wherein each die holding structure is disposed within the cylindrical EMI shield;
- and
- a plurality of semiconductor devices mounted to each die holding structure to form a substantially symmetric die mounting pattern with respect to the central axis of the die holding structure.
Dependencies are inferred from the claim text.