Silicon nitride film of semiconductor element, and method and apparatus for producing silicon nitride film

A silicon nitride film of a semiconductor element formed on a substrate by plasma processing and to be used in the semiconductor element, wherein

• in a case where the silicon nitride film is in contact with a film desired to be supplied with hydrogen,
• the silicon nitride film comprises a first silicon nitride film formed by applying bias to the substrate, and a second silicon nitride film formed without applying any bias to the substrate, and
• the first silicon nitride film is disposed on a side which is in contact with the film.

A method for producing a silicon nitride film to be used in a semiconductor element by performing plasma processing to form the silicon nitride film on a substrate, wherein

• in a case where the silicon nitride film is to be in contact with a film desired to be blocked from being supplied with hydrogen,
• the method comprises the steps of forming a first silicon nitride film by applying bias to the substrate and forming a second silicon nitride film without applying any bias to the substrate as the silicon nitride film, and
• the second silicon nitride film is formed on a side which is in contact with the film.

A method for producing a silicon nitride film to be used in a semiconductor element by performing plasma processing to form the silicon nitride film on a substrate, wherein

• in a case where the silicon nitride film is to be in contact with a film desired to be supplied with hydrogen,
• the method comprises the steps of forming a first silicon nitride film by applying bias to the substrate and forming a second silicon nitride film without applying any bias to the substrate as the silicon nitride film, and
• the first silicon nitride film is formed on a side which is in contact with the film.

An apparatus for producing a silicon nitride film to be used in a semiconductor element by performing plasma processing to form the silicon nitride film on a substrate, comprising bias supplying means for applying bias to the substrate, wherein

• in a case where the silicon nitride film is to be in contact with a film desired to be blocked from being supplied with hydrogen, a first silicon nitride film and a second silicon nitride film are formed as the silicon nitride film and the second silicon nitride film is formed on a side which is in contact with the film,
• when the first silicon nitride film and the second silicon nitride film are formed, the bias supplying means applies the bias to the substrate in the formation of the first silicon nitride film and applies no bias to the substrate in the formation of the second silicon nitride film.

An apparatus for producing a silicon nitride film to be used in a semiconductor element by performing plasma processing to form the silicon nitride film on a substrate, comprising bias supplying means for applying bias to the substrate, wherein

• in a case where the silicon nitride film is to be in contact with a film desired to be supplied with hydrogen, a first silicon nitride film and a second silicon nitride film are formed as the silicon nitride film and the first silicon nitride film is formed on a side which is in contact with the film,
• when the first silicon nitride film and the second silicon nitride film are formed, the bias supplying means applies the bias to the substrate in the formation of the first silicon nitride film and applies no bias to the substrate in the formation of the second silicon nitride film.