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US 2013/0075872 A1Published application
Metal Pad Structures in Dies
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Abstract
A die includes a substrate, a metal pad over the substrate, and a passivation layer that has a portion over the metal pad. A dummy pattern is disposed adjacent to the metal pad. The dummy pattern is level with, and is formed of a same material as, the metal pad. The dummy pattern forms at least a partial ring surrounding at least a third of the metal pad.
Claims20
A device comprising:
- a die comprising:
- a substrate;
- a metal pad over the substrate;
- a passivation layer comprising a portion over the metal pad;
- and
- a dummy pattern adjacent to the metal pad, wherein the dummy pattern is level with, and is formed of a same material as, the metal pad, and wherein the dummy pattern forms at least a partial ring surrounding at least a third of the metal pad.
3 more elements
A device comprising:
- a die comprising corner regions, edge regions, and an inner region encircled by the corner regions and the edge regions, wherein the die further comprises:
- a substrate;
- a first metal pad over the substrate and in one of the corner regions;
- a passivation layer comprising a portion over the first metal pad;
- a metal pillar overlapping and electrically coupled to the first metal pad, wherein the metal pillar extends over a surface dielectric layer of the die;
- a first dummy pattern adjacent to the first metal pad, wherein a portion of the first dummy pattern and a center of the die are on opposite sides of the first metal pad;
- and
- a second metal pad over the substrate and in the inner region, wherein no dummy pattern is adjacent to the second metal pad, wherein the first dummy pattern is level with, and is formed of a same material as, the first metal pad, the second metal pad, and the first dummy pattern.
5 more elements
A device comprising:
- a die comprising corner regions, edge regions, and an inner region encircled by the corner regions and the edge regions, wherein the die further comprises:
- a substrate;
- a first metal pad over the substrate and in a first one of the corner regions of the die;
- a passivation layer comprising a portion over the first metal pad;
- a second metal pad over the substrate and in a second one of the corner regions of the die;
- and
- a first and a second dummy pattern being electrically floating, wherein the first and the second dummy patterns are level with and formed of a same material as the first and the second metal pads, and wherein each of the first and the second dummy patterns forms at least a partial ring surrounding at least a third of the first and the second metal pads, respectively.
4 more elements
Dependencies are inferred from the claim text.