Back to results
US 2013/0075795 A1Published application
Aerogel dielectric layer
AssigneesRaytheon Company, Aspen Aerogels, Inc.
InventorsMark S. Hauhe, Jason G. Milne, Terry C. Cisco
Life of this patent
Estimating the term…
Abstract
A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
Claims22
A circuit board assembly comprising:
- a circuit board;
- a chip attached to the circuit board,
- the chip having a circuit facing the circuit board and spaced from it;
- and
- a dielectric layer between the circuit and the circuit board,
- the dielectric layer comprising an aerogel.
3 more elements
A method for preparing a dielectric layer for a circuit on a chip facing a circuit board and spaced apart from the circuit board, the method comprising:
- applying an aerogel between the circuit and the circuit board.
Dependencies are inferred from the claim text.