Carrier and adhesion amount measuring apparatus, and measuring method, program, and recording medium of the same
AssigneeAdvantest Corporation
InventorsMotoki IMAMURA, Shigeki NISHINA
Life of this patent
Estimating the term…
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AssigneeAdvantest Corporation
InventorsMotoki IMAMURA, Shigeki NISHINA
Estimating the term…
A carrier includes attachment holes to which a catalyst attaches, and non-attachment holes to which the catalyst does not attach. An attachment quantity measurement device includes an electromagnetic wave output device that outputs a terahertz wave toward the carrier, an electromagnetic wave detector that detects the terahertz wave which has transmitted through the carrier, a reference value obtainer that obtains, based on a result detected by the electromagnetic wave detector, any one of an absorption rate, a group delay, and a dispersion of the terahertz wave in the non-attachment holes, and an attachment quantity obtainer that obtains, based on the result detected by the electromagnetic wave detector and the result obtained by the reference value obtainer, a weight or a density of the catalyst present in the attachment holes.
An attachment quantity measurement device comprising:
An attachment quantity measurement method using an attachment quantity measurement device, including an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THz] toward a carrier, including an attachment hole to which a predetermined component attaches and a non-attachment hole to which the predetermined component does not attach, the attachment quantity measurement method comprising:
A non-transitory computer-readable medium having a program of instructions for execution by a computer to perform an attachment quantity measurement process using an attachment quantity measurement device, including an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THz] toward a carrier, including an attachment hole to which a predetermined component attaches and a non-attachment hole to which the predetermined component does not attach;
Dependencies are inferred from the claim text.