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US 2013/0075139 A1Published application
Formation of Connectors without UBM
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Ding Wang, Hung-Jen Lin, Chien-Hsiun Lee
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Abstract
A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.
Claims20
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a passivation layer comprising a portion over the metal pad;
- a post-passivation interconnect (PPI) electrically coupled to the metal pad, wherein the PPI comprises a portion over the metal pad and the passivation layer;
- a polymer layer over the PPI;
- a first solder ball over the PPI, wherein a portion of the solder ball extends into the polymer layer;
- and
- a compound comprising a first portion adjoining the first solder ball and the polymer layer, wherein the compound comprises flux and a polymer.
5 more elements
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a passivation layer comprising a portion over the metal pad;
- a post-passivation interconnect (PPI) electrically coupled to the metal pad, wherein the PPI comprises a portion over the metal pad and the passivation layer;
- a polyimide layer over the PPI;
- a first solder ball over and in physical contact with the PPI, wherein a portion of the first solder ball extends into the polyimide layer;
- and
- a compound comprising a flux and a polymer, wherein the compound extends to over a top surface of the polyimide layer, and is in physical contact with the first solder ball and the polyimide layer.
5 more elements
A method comprising:
- forming a passivation layer comprising a portion over a metal pad;
- forming a post-passivation interconnect (PPI) electrically coupled to the metal pad, wherein the PPI comprises at least a portion over the metal pad and the passivation layer;
- forming a polymer layer over the PPI;
- forming an opening in the polymer layer;
- filling a compound into the opening, wherein the compound is in physical contact with the PPI, and wherein the compound comprises a flux and a polymer;
- placing a solder ball on the compound;
- and
- reflowing the solder ball to join the solder ball with the PPI.
5 more elements
Dependencies are inferred from the claim text.